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Luu Nguyen

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An h-index of 27 places this researcher in Electronics, within the top 5% of 1,159 profiles in this field in our directory.

Featured publications

Solder joint fatigue models: review and applicability to chip scale packages510 citations
Microelectronics Reliability · 2000 · DOI
Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction167 citations
Acta Materialia · 2003 · DOI
Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints161 citations
Applied Physics Letters · 2006 · DOI
Plastic encapsulated microelectronics158 citations
· 1995
Tin whiskers studied by focused ion beam imaging and transmission electron microscopy139 citations
Journal of Applied Physics · 2002 · DOI
Optimization of copper wire bonding on Al-Cu metallization81 citations
IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · DOI
Underfill of flip chip on laminates: simulation and validation78 citations
IEEE Transactions on Components and Packaging Technologies · 1999 · DOI
Aging and creep behavior of Sn3.9Ag0.6Cu solder alloy71 citations
· 2004 · DOI
New characterization techniques for thin polymer films67 citations
Wiley eBooks · 1990
Reliability of Postmolded IC Packages63 citations
Journal of Electronic Packaging · 1993 · DOI

About the field of Electronics

Common research topics in this field:

Energy Harvesting in Wireless NetworksAntenna Design and AnalysisAdvanced MIMO Systems OptimizationAdvanced Wireless Communication TechnologiesEnergy Efficient Wireless Sensor NetworksAdvanced Wireless Communication Techniques

Institutions with the most researchers in this field:

These figures count profiles currently in this directory, not nationwide statistics.

The publication list above is compiled from the open academic database OpenAlex (CC0 licence). Compare with the source record on OpenAlex ↗

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Luu NguyenUniversity of Economics Ho Chi Minh City
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