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Nga Pham

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An h-index of 14 places this researcher in Physics, within the top 10% of 1,880 profiles in this field in our directory.

Featured publications

Through-wafer copper electroplating for three-dimensional interconnects122 citations
Journal of Micromechanics and Microengineering · 2002 · DOI
Spray coating of photoresist for pattern transfer on high topography surfaces121 citations
Journal of Micromechanics and Microengineering · 2005 · DOI
Photoresist Coating Methods for the Integration of Novel 3-D RF Microstructures96 citations
Journal of Microelectromechanical Systems · 2004 · DOI
Sloped Through Wafer Vias for 3D Wafer Level Packaging66 citations
· 2007 · DOI
MEMS packaging and reliability: An undividable couple36 citations
Microelectronics Reliability · 2012 · DOI
Development of vertical and tapered via etch for 3D through wafer interconnect technology35 citations
· 2006 · DOI
A micromachining post-process module for RF silicon technology28 citations
· 2002 · DOI
Molecular-hydrogen interaction with β-SiC(100)3×2 and<i>c</i>(4×2) surfaces and with Si atomic lines26 citations
Physical review. B, Condensed matter · 2001 · DOI
Photoresist coating and patterning for through-silicon via technology26 citations
Journal of Micromechanics and Microengineering · 2008 · DOI
Parylene N as a dielectric material for through silicon vias23 citations
· 2008 · DOI

About the field of Physics

Common research topics in this field:

Graphene research and applicationsQuantum Dots Synthesis And Properties2D Materials and ApplicationsPhotonic and Optical DevicesOptical Network TechnologiesChalcogenide Semiconductor Thin Films

Institutions with the most researchers in this field:

These figures count profiles currently in this directory, not nationwide statistics.

The publication list above is compiled from the open academic database OpenAlex (CC0 licence). Compare with the source record on OpenAlex ↗

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Nga PhamVNU University of Science
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