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Van-Nhat Le

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Featured publications

Depth of cut per abrasive in fixed diamond wire sawing67 citations
The International Journal of Advanced Manufacturing Technology · 2015 · DOI
Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module52 citations
International Journal of Solids and Structures · 2016 · DOI
A design of a new miniature device for solder joints’ mechanical properties evaluation21 citations
Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science · 2016 · DOI
Influence of Abrasive Density on the Material Removal Mechanisms in Diamond Wire Sawing of Silicon Crystal
Lecture notes in networks and systems · 2022 · DOI
Development of a Sintering System and Effect of Sintering Pressures on the Mechanical Properties and Microstructure of Silver-Sintered Joints for High-Power Applications
SSRN Electronic Journal · 2025 · DOI
Effect of Sintering Pressures and Sintering Layer Thickness on the Mechanical Properties and Microstructure of Silver-Sintered Joints for High-Power Applications
SSRN Electronic Journal · 2025 · DOI
Influence of sintering pressure and joint thickness on the mechanical and fracture behavior of silver-sintered joints
· 2025 · DOI
Micromechanical Model for Describing Intergranular Fatigue Cracking in an Innovative Solder Alloy
Lecture notes in civil engineering · 2017 · DOI

About the field of Electronics

Common research topics in this field:

Energy Harvesting in Wireless NetworksAntenna Design and AnalysisAdvanced MIMO Systems OptimizationAdvanced Wireless Communication TechnologiesEnergy Efficient Wireless Sensor NetworksAdvanced Wireless Communication Techniques

Institutions with the most researchers in this field:

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Van-Nhat LeDa Nang University
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